Electronics assembly technology - Endurance test methods for solder joint of area array type package surface mount devices1 Scope This part of IEC 62137 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and

• sway stability

These items are considered to comply with BS EN 60684-3-229 if they fulfil with the property requirements listed in BS EN 60684-3-229 excluding dimensions

Technical teams

this document is applicable to

HPLC determination

and solutions to

The biogas is collected in a bag under atmospheric pressure

Video cassettes recording system manufactures

which could be very helpful for you to manufacture reliable and high-quality touring ski boots for adults specifically

sampling) or in the laboratory (e

With the notched-bar impact testing we determine the toughness of a metallic or polymeric material under various temperature conditions

4 Cut resistance